Diamond saw die separation tightly controls the resistor's dimensional tolerances,
thus improving pick and place assembly by reducing components misplacement
unique, (5) sided construction of the wrap around termination maximizes
component to board solder adhesion in a way that minimizes component tombstoning.
fine nozzle, sand blasting method of abrasively trimming resistors results
in a component that has lower noise, better short and long term stability
and improved power handling characteristics than a LASER trimmed component.
resistors are fabricated with the resistor film sandwiched between a bottom
conductor and a top conductor termination. This construction exposes the
maximum bond pad area for multiple wire bonds, automated wire bonding and
solder coverage. Also inherent to this design is better long term stability,
and power handling.
solder dip tinning for optimum shelf life and best solder wetting.
screened on backside conductors provides a uniform clear space and prevents
materials are continuously tested for mechanical and electrical performance
parameters to Mil-PRF-55342. Our current DESC failure rating is "S",
which represents more than (91) million hours of life testing without a
consistent by controlled dimensions imparted by (5) precise screenings.