Mini-Systems, Inc.  Leaders in precision chip resistor technology since 1968
Electronic Packages
Capabilities, Products and Catalog

MSI’s Electronic Package Division offers a wide range of hermetic electronic packages for harsh environments and critical applications. We specialize in glass-to-metal seal hermetic packages. MSI’s packages — Alumina/Glass sidewall flatpacks — are best known for the hybrid alternate to ceramic and plastic microelectronic packages and meet military and space-level quality while exceeding all commercial needs. Our packages meet or exceed MIL-STD-883 and JEDEC Standard No. 9B.

Our customers know they can rely on MSI to produce custom-designed, high reliability hermetic packages for their most demanding applications. Knowledgeable sales and engineering staff are trained to provide quick responses to our clients’ questions and critical requirements. 

MSI products have served the Aerospace, Communication, Military, Medical and Industrial fields reliably for over forty-five years.

  • Specialize in Glass-to-Metal seal High-Reliability Hermetic Electronic Packages 
  • Low temperature and high temperature brazing
  • Small packages with multi leads
  • Small pitch packages
  • Hermeticity less than 10-10 atm cc/sec per MIL-STD-883, Method 1014, Condition A4
  • Meet or exceed Package Evaluation Requirements per MIL-PRF-38534, Table C-VI
  • Plating per MIL-DTL-45204 over QQ-N-290 or MIL-C-26074 or AMS 2404
  • Custom design available

High-reliability hermetic electronic packages:

  • Glass sidewall flatpacks
  • Metal flatpacks
  • Plug-ins
  • Power surface mounts
  • Ceramic quad flatpacks
  • Leadless chip carriers
  • SO-8 and SO-14 glass flatpacks
  • Lids and covers

Ethics Statement

Ethical business practices is the highest priority of Mini-Systems, Inc. This includes our employees, customers, suppliers and subcontractors. We are an equal opportunity employer, comply with all laws & regulations and protect intellectual property. To report any violations please call 1-508-695-0203.